NVIDIA is hiring a Senior Packaging Technical Engineer to define chip pad rings, substrate interconnect schemes, floor plans, and ball-out implementations for robust electrical packages. The role collaborates with circuit, signal integrity, RTL, place-and-route, substrate layout, and system design teams and requires strong electrical packaging knowledge, transmission-line and power-delivery understanding, and programming or scripting skills.
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mise en réseauSanta Clara, CA, US10001+
We create the world’s fastest supercomputer and largest gaming platform.
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