Description
NVIDIA is hiring a Senior Packaging Technical Engineer to define chip pad rings, substrate interconnect schemes, floor plans, and ball-out implementations for robust electrical packages. The role collaborates with circuit, signal integrity, RTL, place-and-route, substrate layout, and system design teams and requires strong board or system design experience, preferably with package design, along with knowledge of transmission line theory, power delivery, and signal integrity. Programming, scripting, Cadence, and Excel skills are also mentioned.
