Description
NVIDIA is hiring a Package Engineer to define and implement chip pad rings, substrate interconnect schemes, floor plans, and ball-outs, and to lead package layout design. The role collaborates with circuit, signal integrity, RTL, place-and-route, substrate layout, and system design teams. Candidates need a BSEE or equivalent and at least 8 years of board or system design experience; package design, transmission-line theory, power delivery, signal integrity, and scripting skills are preferred. The base salary is 168,000–258,750 USD for Level 4 and 200,000–322,000 USD for Level 5, with equity and benefits available. Applications were accepted until August 22, 2026.
