Description
Microsoft is hiring a Physical Design Engineer to join its semiconductor design team and perform physical design implementation and integration across block, subsystem, sub-chip, and full-chip levels. The role covers floorplanning, synthesis, placement, clocking, routing, static timing, physical verification, formal equivalency, power efficiency, IR-drop, and EM, with possible involvement in flow development, technology and IP evaluation, and vendor selection. Candidates need a bachelor’s or master’s degree in electrical or computer engineering or a related field, at least 8 years of experience, physical design signoff experience, and experience tapeouting complex ASICs in leading-edge technology. The position may require access to export-controlled information and occasional travel.
