Description
The role leads front-end IC process integration for new-technology introductions, foundry process transfers, and new-fab enablement across NXP’s APAC Central Competence Team. Responsibilities include qualifying and releasing processes, driving manufacturability and yield improvement, coordinating with foundries, technology groups, business lines, and customers, and steering projects to timely completion. The position requires a bachelor’s or master’s degree in physics or electrical engineering, more than 10 years of front-end IC process-integration experience, knowledge of HV/BCD devices, yield-enhancement and data-analysis skills, and fluency in English, Chinese, and spoken Mandarin.
