Description
The role leads front-end IC process integration for new-technology introductions, foundry process transfers, and new-fab enablement across NXP’s APAC Central Competence Team. Responsibilities include qualifying and releasing processes, driving manufacturability and yield improvement, coordinating with foundries, technology groups, business lines, and customers, and steering projects to timely completion. The position requires a bachelor’s or master’s degree in physics or electrical engineering, more than 10 years of front-end IC process-integration experience, strong IC-device and process knowledge, yield and data-analysis expertise, English and Mandarin fluency, and leadership experience in development, transfer, or production ramp-up projects.
