Description
Micron Technology is hiring a senior Process Engineering Technical Leader focused on chip‑to‑wafer and hybrid bonding for advanced packaging. The role leads the development and scale‑up of bonding processes for high‑performance 3D memory products such as HBM and 3DS DRAM, covering early pathfinding through high‑volume manufacturing. Responsibilities include setting technical direction, developing process flows and materials, solving cross‑functional wafer‑fab and packaging problems, and driving technology transfer. The position requires a master’s degree or PhD in a relevant engineering field and at least 13 years of semiconductor R&D experience, including 10 years in advanced packaging.
