Description
Microchip Technology Inc. is hiring a Senior Process Technician to support the setup, operation, monitoring, troubleshooting, and continuous improvement of PLP Fan-Out Wafer Level Packaging (FOWLP) and Fan-In WLCSP manufacturing processes. The role provides technical support to process engineers and production teams, maintains process integrity and equipment uptime, supports new-product qualification, and contributes to yield improvement and production ramp-up. Candidates need a technical diploma or degree in electronics, engineering, semiconductor manufacturing, or mechatronics, plus 2–5 years of experience in electronics or semiconductor manufacturing, including Fan-In and Fan-Out Wafer Level Packaging experience. Travel time is 0–25%.
