Senior Program Managers at Intel

Language

Location: Tokyo
Type: Full-time
Level: senior
Posted: Jul 16, 2026

Description

Intel is hiring an Advanced Packaging Process Engineer to develop and qualify substrate and wafer assembly technologies for AI devices. The role focuses on supplier capacity and lead-time management, process control, factory startup and ramp-up, yield improvement, and certification activities. It requires regular onsite presence at supplier and factory sites, including at least three days per week, and is based in Tokyo, Japan.

Required Skills

Process development
Capacity management
Lead-time analysis
Yield improvement
Supplier influence
Problem solving
Factory operations

Additional Information

Minimum Education: Bachelor's or Master's degree in Science or Engineering with 8+ years of experience, or a PhD with 4+ years of work experience
Required Previous Experiences: 6+ years of experience in fab back-end or substrate manufacturing process development
Preferred Qualifications: Experience in capacity management, lead-time analysis, yield improvement, structured problem solving, situational leadership, supplier influence, and stakeholder management
Strong understanding of substrate process building blocks, including component embedding, laser drilling, dielectric lamination, lithography, multi-metal electrolytic plating, defect inspection/metrology, and electrical testing
Experience qualifying or owning process tools in a time-decision, ramp, or high-volume manufacturing context
Hands-on experience in factory operations, substrates, manufacturing, process engineering, and yield improvement
Fluent business-level English communication, presentation skills, and ability to engage with supplier executive management
Translation Company Name: 650 Intel Kabushiki Kaisha