Description
Applied Materials is hiring a Process Engineer in Singapore to design and optimize advanced packaging and 3D integration processes for quantum devices and related semiconductor technologies. The role involves process experiments, data collection and analysis, hardware and materials characterization, root-cause troubleshooting, technical documentation, and collaboration with customers, universities, startups, vendors, and R&D teams. Candidates need a degree in a relevant field, at least five years of experience in advanced packaging or semiconductor process development, and expertise in technologies such as hybrid bonding, TSV, chiplets, and flip-chip.
