Description
Black Semiconductor is hiring a CMP Process Engineer to lead the development and implementation of chemical mechanical polishing processes for next-generation materials and device architectures, including 2D materials such as graphene. The role covers fab startup activities, tool installation and acceptance testing, recipe validation, process-of-record establishment, ramp-to-production protocols, CMP tool and consumable qualification, and SPC and continuous improvement. Candidates need at least five years of semiconductor process engineering experience focused on CMP, along with contamination-control, surface-preparation, CMP consumables, and 300mm plating tool experience.
