Description
Intel is hiring a Silicon Packaging Design Engineer in its Data Center Group to develop substrate designs from concept through tapeout. The role involves physical layout and routing, fit and routing studies, package interconnect and power-delivery optimization, design-rule enforcement, design reviews, documentation, and package design for manufacturability. Candidates need an electronic or electrical engineering diploma, at least six months of semiconductor design experience, and proficiency with substrate design tools; the position is based in Bangalore, India, and requires an on-site presence.
