Description
Apple is hiring a senior-level advanced packaging engineer to develop and deploy new packaging technologies for products. The role interfaces with product and device design, process integration, and external suppliers; evaluates photonic packaging technologies; develops co-package optics; performs proof-of-concept builds, validation, qualification, yield analysis, and continuous improvement; manages packaging roadmaps and R&D activities; and coordinates with suppliers to meet product development and ramp schedules. The position requires an M.S. or Ph.D. in a relevant discipline, at least five years of experience in high-performance computing, data center, or silicon photonics applications, and knowledge of advanced 2.5D/3D packaging and photonic component assembly. At least 5–10% travel to domestic and international locations is required.
