Description
Micron Technology is seeking an advanced packaging process engineer to drive HBM process development and yield improvement in WSS processes, support advanced packaging research and development, execute on-site projects, troubleshoot complex process issues, and perform root-cause analysis. The role also involves materials characterization, test-structure and test-vehicle design, supplier discussions, and technical reporting. Candidates need a master's degree or higher in a chemistry, physics, materials, or engineering science field, at least two years of bonding-related experience, knowledge of WSS and bonding technologies, and fluency in English and Chinese.
