Description
Micron Technology is seeking an Advanced Packaging Process Engineer to drive HBM process development and yield improvement in FILMs processes, support advanced packaging research and development, execute on-site projects, troubleshoot complex process issues, and perform root-cause analysis. The role also involves materials characterization, test structure and vehicle design, supplier discussions, and technical reporting. Candidates need a master's degree or higher in a chemistry, physics, materials, or engineering science field, at least three years of FILMs experience involving CVD or PVD, thin-film deposition knowledge, and fluency in English and Chinese.
