Description
ASE is hiring a Senior Application Engineer to support semiconductor customers and internal engineering teams with IC packaging solutions. The role involves reviewing customer devices, supporting new product introductions and volume production, developing advanced high-speed and high-performance packages, evaluating packaging feasibility, resolving field and design issues, and coordinating with R&D, manufacturing, sales, and customers. The position requires a BS degree in engineering or a related field, at least eight years of IC packaging and IC assembly experience, knowledge of IC packaging design rules and quality control, and proficiency with Microsoft Office. The full-time position offers a base salary of $120,000 to $160,000 and medical, dental, vision, prescription, flex plan, and life insurance benefits.
