Description
Micron Technology is hiring a Senior Advanced Assembly Technology Development Engineer to introduce and develop next-generation semiconductor packaging technologies, including flip chip, TCB, and hybrid bonding. The role involves process setup, DOE execution, sample building, data analysis, troubleshooting, process transfer from technology development to high-volume manufacturing, and collaboration with material, bumping, PI, NPI, quality, and manufacturing teams. The position requires at least three years of assembly-process experience, strong technical problem-solving and data-analysis skills, English fluency, excellent communication, and a master's degree in a relevant engineering or science field.
