Description
AWS is hiring a Sr. Cloud Hardware Development Engineer (CHDE) with packaging expertise for its Network Product Development team. The role designs, develops, validates, deploys, and sustains IC and SOC packages for high-speed network interconnects, collaborating with design teams, manufacturing partners, and cross-functional stakeholders. Responsibilities include evaluating packaging technologies, developing test plans for signal, power, thermal, and mechanical reliability, and improving manufacturing yields and RMA processes. The position requires a bachelor's degree or above in a relevant engineering or science field, at least 8 years of IC/SOC packaging experience, high-speed signal integrity expertise, supplier qualification experience, and automation scripting experience. The role is based in Cupertino, California, with a base salary of 183,000.00–247,600.00 USD annually.
