Description
SiTime is hiring a Packaging Technology Leader to drive its packaging roadmap and architecture for co-packaged MEMS. The role leads OSAT and foundry partnerships, mechanical and electrical packaging design, advanced materials qualification, packaging laboratory workflows, yield and productivity improvements, and the development of high-performance global engineering teams. Candidates need a Ph.D. or Master’s degree in a relevant field, at least 10 years of semiconductor packaging R&D experience including 5 years leading advanced heterogeneous integration teams, and expertise in process integration, metrology, and cross-functional leadership. The annual base salary is $238,950 to $341,710, with quarterly innovation bonuses, equity grants, and medical, dental, vision, and other benefits.
