Description
Renesas Electronics is hiring a Sr. Director, Packaging Development and Assembly Engineering to lead a new organization responsible for packaging development, new product introduction, and assembly engineering continuous improvement. The role will establish program governance, manage end-to-end NPI plans, coordinate with internal and OSAT/CM partners, resolve technical and quality risks, develop global packaging and assembly teams, and ensure reliable transition to volume manufacturing. The position requires relocation to or based in India for a two-year project assignment and offers an annual salary of $230,000–$290,000 plus bonus opportunities.
