Description
Micron Technology is seeking a Process Engineer to drive HBM process development and yield improvement in the DRY ETCH process, support advanced packaging research and development, execute on-site projects, troubleshoot complex process issues, perform root-cause analysis, and prepare technical documentation. The role also involves materials characterization, mechanical testing, test-structure design, and coordination with packaging material suppliers across global sites. Candidates need at least four years of semiconductor industry experience, a master's degree or higher in a relevant science or engineering field, DRY ETCH process experience, and fluency in English and Chinese.
