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Sr. Manager, Assembly Process Development (APTD) at Micron

Department: HIG

Language
Setup
On-site
Location
Taichung
Level
lead/mgmt
Posted

Description

The Advanced Packaging Manager leads technology development strategy and long-term technical objectives for advanced packaging, including 2.5D, 3DIC, flip-chip, hybrid bonding, and related processes. The role provides cross-functional leadership, guides quality, cost, efficiency, and delivery outcomes, develops team members, and champions AI-enabled automation and data analytics. It requires at least 10 years of packaging experience, including 5 years in advanced packaging, a relevant master’s or doctoral degree, and expertise in advanced packaging processes, materials, testing, failure analysis, and data analysis.

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