Description
The role leads manufacturing engineering improvement projects in a semiconductor packaging and testing factory, advancing lean production, automation, digitalization, equipment OEE, process stability, and standardized engineering practices. It also covers new equipment and process evaluation, data-driven process monitoring, cross-functional coordination, and support for equipment systems and smart-manufacturing initiatives. The position requires a bachelor's degree in a relevant engineering discipline, at least five years of semiconductor packaging, assembly, or equipment-management experience, familiarity with semiconductor packaging equipment and processes, and strong analytical, problem-solving, and cross-functional communication skills.
