Description
The Wire Bonding Process Engineer will develop wire-bonding processes for new semiconductor products and packages, establish process windows and bonding conditions, and lead NPI validation, yield improvement, SPC, troubleshooting, and continuous quality improvement. The role also manages new materials, optimizes process parameters, maintains process specifications, and supports reliability and risk assessment. A bachelor’s degree in engineering or a related field is required, while semiconductor manufacturing, process or equipment engineering, wire-bonding, NPI, data analysis, Microsoft Office, communication, teamwork, and English proficiency are preferred or required qualifications.
