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Sr RDA Engineer, Advanced Packaging at Micron

Department: HIG

Setup
On-site
Location
Boise, Idaho
Level
mid
Posted

Description

Micron Technology is hiring a Realtime Defect Analysis (RDA) Engineer in its Advanced Packaging Technology Development department. The role analyzes experimental semiconductor process flows, detects and quarantines out-of-control tools, investigates defect anomalies, supports inspection-tool development, and collaborates with global R&D, process, data science, and yield teams to improve technology transfer and yield. The position requires a bachelor’s degree in a relevant engineering or materials science field, 4–6 years of semiconductor industry experience, at least 3 years of RDA experience, semiconductor fabrication knowledge, data manipulation skills, and strong communication skills.

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