Description
Infineon is hiring a semiconductor packaging R&D engineer to integrate technology in R&D, lead PBC and TPC assessments, drive the package technology DFMEA process, assess and mitigate risks, integrate BOM and process unit processes, support FE/BE integration, ensure manufacturing-route stability for mass production, and contribute to product-portfolio extension. The role requires a relevant engineering degree, at least 10 years of semiconductor packaging experience, knowledge of DFMEA and reliability analysis, statistical analysis skills, and strong cross-functional communication.
