Description
Applied Materials is hiring a full-time CMP Service Engineer to serve as a technical expert in Chemical Mechanical Planarization for semiconductor wafer fab customers. The role leads customer discussions, continuous improvement projects, defect and variability reduction, tool troubleshooting, advanced process integration, and adoption of FabVantage offerings, while mentoring junior MPEs and contributing to CMP expert networks. Candidates need a BS in Engineering, 10+ years of CMP process experience, wafer fab process or equipment experience, and knowledge of at least three CMP process types. The position is based in Boise, Idaho or Hillsboro, Oregon, requires 20% travel, and offers a target total cash salary of $140,000 to $192,500.
