Description
Renesas is hiring a Semiconductor Packaging Engineer to design and develop package and interconnect methods for power SiP/modules, flip-chip LGA, multi-chip modules, and power-device packaging. The role collaborates with OSAT/CM, product groups, reliability teams, and customers to optimize processes, qualify packages, resolve production issues, and maintain expertise in advanced leadframe, flip-chip, and metallization technologies. Candidates need a relevant bachelor’s or master’s degree and 5–15 years of semiconductor packaging development experience.
