Description
The role focuses on qualifying, sustaining, and improving manufacturing processes for Power QFN packages and Cu Clip-related thin-die assemblies, including SPS product qualification, volume ramp-up, yield and cost improvement, supplier change management, NPI-to-production transfers, and OSAT or contract-manufacturing support. It requires a degree in a relevant science or engineering field, experience with thin-wafer handling and SPS solder-attach processes, knowledge of quality and reliability requirements, SPC, and statistical analysis tools, along with strong communication and project-management skills.
