Description
Renesas Electronics is hiring a Package Expert to support sustaining engineering for mature power IC products in high-volume production. The role owns multiple product lifecycles, oversees mass-production assembly readiness, resolves manufacturing issues, improves yield, volume, test time, and COGS, manages MRB and PCRB risks, and coordinates with design, test, manufacturing, quality, reliability, factory, and OSAT teams. Candidates need at least five years of package development and process engineering experience, a bachelor's degree in a relevant engineering field, experience with CuClip thin-die and SPS solder-attach processes, and onsite availability.
