Description
The Semiconductor Assembly Engineer will own and improve die attach, wirebond, inspection, and other assembly processes for monolithically integrated optical circuits in a 24x7 manufacturing and development facility. The role covers process and tool ownership, equipment performance, NPI, yield, reliability, controlled experiments, new tool qualification, clean-room operations, and mentorship of operators and junior engineers. It requires hands-on microelectronics assembly experience, process engineering and statistical methods, failure analysis, data analysis, and a bachelor’s degree with 8 years of related experience or a master’s degree with 5 years of semiconductor packaging and assembly experience.
