Description
Micron Technology is hiring an Advanced Packaging R&D Engineer to develop and scale mechanical wafer-processing modules for edge trim, backgrind, and thinning. The role focuses on process optimization, yield and reliability improvement, root-cause analysis, early-stage pathfinding, and support of process transfer to manufacturing. Candidates need a BS or MS degree, at least four years of relevant semiconductor wafer-processing experience, and expertise in experimental design, data analysis, and complex process problem-solving. The position offers medical, dental, and vision plans and other benefits.
