Description
The role supports the definition, design, and verification of semiconductor package designs, including DFM, DFA, signal and power delivery networks, and coordination with external vendors. It requires an electrical engineering degree or equivalent, experience with 2.5D and 3D package systems and their SI/PI requirements, and at least 9 years of recent experience using Cadence APD and Allegro toolsets. The position also emphasizes adaptability, minimal supervision, standardization, and efficiency improvements, with Python, SKILL, or TCL programming experience preferred.
