STAFF ENGINEER, DRY ETCH DRAM at Micron

Department: DTPG

Setup: On-site
Location: Boise, Idaho
Level: mid
Posted: Jul 29, 2026

Description

Micron Technology is hiring a DRAM Dry Etch Engineer to develop and optimize plasma dry-etch processes for next-generation memory devices in a research and development environment. The role covers process development, root-cause analysis, yield and defect improvement, data-driven process capability analysis, and support for process transfer and production issue resolution. Candidates need an MS or PhD with 3–5 years of relevant experience, or a BS with 5–10 years of semiconductor experience, along with dry-etch, plasma, and statistical process-control expertise.

Required Skills

Plasma etching
Dry etch development
Plasma physics
SPC
Root cause analysis
FMEA

Additional Information

Minimum Education: MS or PhD, or BS with 5–10 years of semiconductor experience
Required Previous Experiences: 3–5 years of relevant experience for MS or PhD candidates
5–10 years of semiconductor experience for BS candidates
Dry etch process development in semiconductor manufacturing or R&D
Statistical methods, SPC, and data-driven problem solving
Preferred Qualifications: DRAM process or module ownership
ICP and CCP dry etch systems
Transport phenomena, surface interactions, and plasma processes
FMEA, 8D, or advanced defect analysis
AI for data analysis, process optimization, or engineering workflows