Description
Micron Technology is hiring a Global Quality (GQ) Package Reliability Engineer to own package quality and reliability for DRAM and HBM product lines. The role covers package qualification, phase-gate approvals, HVM monitoring and dispositions, reliability test planning, root-cause and corrective-action coordination, critical-issue reporting, and CTQ compliance through design to production release. Candidates need a relevant engineering degree, at least 10 years of experience in PWF, DCA, and 3DS packaging, and knowledge of semiconductor packaging, reliability testing, failure analysis, and related software systems.
