Description
Infineon is seeking a Wire Bonding Process Engineer to develop and qualify wire-bonding processes for semiconductor products and packages, establish process controls, support prototype builds, document processes, resolve yield and quality issues using SPC, DOE, 8D, and FMEA, develop new wire-bonding technologies, and guide suppliers and junior engineers. The role requires a relevant bachelor’s or master’s degree, at least three years of semiconductor packaging and wire-bonding experience, knowledge of wire-bonding equipment and failure modes, proficiency with statistical tools, and hands-on laboratory skills.
