Description
Qualcomm is hiring a Failure Analysis Engineer to lead FA test interfaces, advanced socketing, and thermal management solutions for Electrical Fault Isolation across mobile, compute, automotive, networking, and AR/VR platforms. The role develops custom sockets and carrier boards, optimizes FA hardware for silicon-on-dock readiness, evaluates thermal and electrical solutions, and collaborates with design, product engineering, yield, and reliability teams. Candidates need a bachelor’s degree in a related field and 2–4 years of hardware engineering experience depending on their degree, with advanced semiconductor, socketing, power delivery, signal integrity, and thermal analysis experience preferred. The listed pay range is $141,300 to $211,900.
