Description
Renesas is hiring a Staff Package Design Engineer for its Advanced Silicon Packaging team in Austin, Texas or Tempe, Arizona. The role designs and delivers advanced semiconductor packages, including power modules, FCBGA, SiP, WLCSP, multi-chip modules, and chiplet architectures, while managing package CAD databases, layout execution, manufacturing release outputs, design verification, and cross-functional co-optimization with silicon, signal integrity, power integrity, thermal, reliability, and manufacturing teams.
