Description
Arm is hiring a Staff Engineer for its System-in-Package team to define, design, and verify package designs for next-generation SoCs in IoT, automotive, and compute applications. The role involves 2.5D and 3D package systems, DFM/DFA, signal and power delivery, bump-map and ball-pattern optimization, Cadence APD and Allegro toolsets, package routing, stack-up creation, and coordination with IP, PCB, SI/PI, Systems, and external vendor teams. The position requires an electrical engineering degree or equivalent experience, 5–7+ years of recent Cadence APD and Allegro experience, and familiarity with 2.5D and 3D package systems; Python, SKILL, or TCL programming is a plus. The salary range is $209,100–$282,900 per year, with hybrid working arrangements determined by team needs.
