Description
The Power Module Packaging Engineer will design and develop embedded-die-laminate power modules for Renesas’s commercial-industrial server and AI applications, including SMT of capacitors and inductors. The role covers package technology and tooling qualification, material and process selection, OSAT qualification, AutoCAD package drawings, DOE optimization, reliability qualification, and packaging roadmap execution. Candidates need a doctorate, master’s, or bachelor’s degree in a relevant engineering or science field and 5–12 years of experience in power-module packaging.
