Description
Micron is hiring an advanced-packaging process-development engineer to develop and optimize assembly processes for wafer-level packaging, die stacking, and chip-on-wafer technologies. The role focuses on yield, quality, cost, productivity, equipment and materials evaluation, process control, data analytics, defect analysis, and the transfer of processes from development through high-volume manufacturing. Candidates need a relevant advanced degree with substantial experience, semiconductor process or equipment development experience, and proficiency in Python, R, SQL, Visual Basic, and semiconductor process-control systems.
