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Staff Process Engineer, Advanced Packaging CMP at Micron

Department: HIG

Setup
On-site
Location
Boise, Idaho
Level
staff+
Posted

Description

Micron Technology is hiring a Staff Process Engineer for its Advanced Packaging CMP team. The role focuses on starting up, developing, and optimizing chemical mechanical planarization processes to improve product quality, reliability, yield, cost, productivity, and risk management, while diagnosing manufacturing and assembly problems using failure analysis, FMEA, 8D, and SPC/FDC methods. Responsibilities include research, equipment and consumables evaluation, process monitoring, technical advisory work, complex multi-functional projects, innovation and patent development, and vendor collaboration. The position requires a BS or MS in a relevant engineering or science field and at least five years of CMP experience in the semiconductor industry, along with hands-on CMP equipment and process development experience.

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