Description
Micron Technology is hiring a Process Engineer for its Advanced Packaging Technology Development Bonding team. The role develops and optimizes bonding processes, improves yield, productivity, cost, and reliability, resolves manufacturing and assembly problems, evaluates new processes and materials, supports SPC/FDC and site-to-site portability, and audits suppliers. Candidates need a relevant bachelor's degree plus five years of industry experience, semiconductor packaging knowledge, DOE, SPC, defect analysis, and data-analysis experience, along with root-cause or model-based problem-solving ability.
