Description
The role focuses on qualifying, sustaining, and improving assembly processes for Power QFN packages and Cu Clip-related thin-die assemblies used in SPS products. Responsibilities include package development, manufacturing ramp-up, source qualification, line sustaining, yield and cost improvement, customer issue resolution, product lifecycle management, supplier change management, and coordination with quality, reliability, test, and operations teams. The position requires a relevant science or engineering degree, experience in process engineering or package development, knowledge of solder attach and wire bonding, SPC and statistical analysis, and strong communication and project-management skills.
