Description
The role focuses on qualifying, assembling, sustaining, and improving processes for Power QFN packages and Cu Clip-related thin-die assemblies, including SPS product qualification, manufacturing ramp-up, yield and cost improvement, supplier change management, and NPI-to-production transfers. It requires a degree in a relevant science or engineering field, experience in process engineering or thin-wafer and SPS solder-attach processes, knowledge of package quality and reliability, SPC, and statistical analysis tools, along with strong communication and project-management skills.
