Description
The Manufacturing Engineer will qualify and sustain assembly processes for Power QFN packages and Cu Clip-related thin-die assemblies, including SPS solder attach and ultra-thin wafer handling. The role covers NPI-to-production transfers, manufacturing ramp-up, source qualification, line sustainment, yield and cost improvement, supplier change management, and coordination with quality, reliability, test, product, and operations teams. It also manages OSAT and contract-manufacturing relationships and Product Lifecycle Management documentation. The position requires a relevant science or engineering degree, experience in process engineering or package development, knowledge of quality and reliability requirements, SPC and statistical analysis, and strong communication and project-management skills.
