Description
The role focuses on qualifying, assembling, sustaining, and improving processes for Power QFN packages and Cu Clip-related thin-die assemblies for SPS products. Responsibilities include package development, manufacturing ramp-up, source qualification, line sustaining, yield and cost improvement, customer issue resolution, product lifecycle management, supplier change management, and coordination with quality, reliability, test, and operations teams. The position requires a degree in a relevant science or engineering field, experience in process engineering or package development involving thin-wafer handling and SPS solder attach, and knowledge of wire bonding, SPC, statistical analysis, and related semiconductor manufacturing practices.
