Description
Qualcomm is hiring a Si Process Packaging Solutions Engineer to evaluate, develop, and enable silicon process technology for mixed-signal and RF products at foundry partners. The role covers RF switching, antenna circuits, receivers, transmitters, test structures, DOE, layout, characterization, RF circuit simulation, PDK and reliability support, product testing, and process-device optimization. Candidates need a bachelor's, master's, or PhD in science, engineering, or a related field plus 2–4 years of ASIC design, verification, validation, integration, or related experience, with advanced CMOS, RF-CMOS, SOI, BiCMOS, PDK, and device-modeling expertise preferred. The listed pay range is $145,600 to $218,400.
