Structural/ Thermal Modeling Engineer 3 at LAM

Setup: Hybrid
Level: not_specified
Posted: Apr 14, 2026

Summary from listing

Lam Research is seeking a graduate-eligible R&D engineer to develop physics-based, data-driven, and multi-physics models for semiconductor capital equipment. The role covers thermo-elastic, structural, CFD, uncertainty quantification, optimization, statistical analysis, and the use of AI/ML methods to improve mechanical designs and correlate simulation with experimental data. Candidates need a PhD in mechanical engineering or a closely related field, strong AI/ML and hybrid modeling knowledge, coding ability, and experience leading cross-functional design reviews. The role may be performed under an on-site flex or virtual flex hybrid arrangement.

Required Skills

AI/ML
Multi-physics modeling
Uncertainty quantification
Statistical methods
Coding
DOE and optimization

Additional Information

Minimum Education: PhD in Mechanical Engineering or a closely related field, with emphasis on solid mechanics, heat transfer, and fluid mechanics.
Preferred Qualifications: Experience with commercial simulation software such as ABAQUS, ANSYS, NASTRAN, or COMSOL.
Knowledge of chemistry, semiconductor metrology, sensors, and vacuum hardware.
Big data and AI/ML algorithms.
Multi-scale modeling across nano, meso, and macro scales.
Heat transfer in low-pressure regimes.
High-performance computing, optimization, and cloud computing.
Numerical methods including SPH, molecular dynamics, BTE, spectral elements, and DSMC.
Thin-film mechanics and characterization.
Ceramic materials.
Fracture mechanics and fatigue.
Uncertainty qualification, error analysis, and statistical methods.
Statistical theory, design of experiments, and optimization algorithms.