Description
Etched is hiring a Substrate IC Package Layout Design Engineer to design complex, large-scale IC substrate packages for high-power AI processors and accelerators. The role covers multi-layer substrate layouts, power delivery networks, high-speed signal routing above 50GHz, CoWoS interposer optimization, DRC and LVS verification, design documentation, and cross-functional collaboration with silicon, signal integrity, power integrity, packaging, and manufacturing teams. The position requires a bachelor’s or master’s degree in a relevant engineering field and at least 10 years of IC substrate layout experience, with work based in San Jose or Taipei.
